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document number: mc145012 rev 9.0, 11/2006 freescale semiconductor technical data ? freescale semiconductor, in c., 2006. all rights reserved. photoelectric smoke detector ic with i/o and temporal pattern horn driver the cmos mc145012 is an advanced smok e detector component containing sophisticated very-low-power analog and digital circuitry. the ic is used with an infrared photoelectric chamber. detection is accomplished by sensing scattered light from minute smoke particles or other aerosols. when detection occurs, a pulsating alarm is sounded via on-chip push-pull drivers and an external piezoelectric transducer. the variable-gain photo amplifier allows direct interface to ir detectors (photodiodes). two external capacitors, c1 and c2, c1 being the larger, determine the gain settings. low gain is selected by the ic during most of the standby state. medium gain is selected during a local- smoke condition. high gain is used during push-button test. during standby, the special monitor circuit which periodically checks for degraded chamber sensitivity uses high gain also. the i/o pin, in combination with v ss , can be used to interconnect up to 40 units for common signaling. an on-chip current sink provides noise immunity when the i/ o is an input. a local-smoke condition ac tivates the short-ci rcuit-protected i/o driver, thereby signaling remote smoke to the interconnected units. additionally, the i/o pin can be used to activate escape lights, enable auxiliary or remote alarms, and/or initiate auto-dialers. while in standby, the low-supply detection circuitry conducts periodic checks using a pulsed load current from the led pin. the trip point is set using two external resistors. the supply for the mc145012 can be a 9.0 v battery. a visible led flash accompanying a pulsating audible alarm indicates a local- smoke condition. a pulsating audible alarm with no led flash indicates a remote- smoke condition. a beep or chirp occurri ng virtually simultaneously with an led flash indicates a low-supply condition. a beep or chirp occurring halfway between led flashes indicates degraded chamber s ensitivity. a low-supply condition does not affect the smoke detection capability if v dd 6.0 v. therefore, the low-supply condition and degraded chamber sensitiv ity can be further distinguished by performing a push-button (chamber) test. features ? circuit is designed to operate in sm oke detector systems that comply with ul217 and ul268 specifications ? operating voltage range: 6.0 v to 12 v, average supply current: 8 a ? operating temperature range: -10 to 60 c ? i/o pin allows units to be interconnected for common signalling ? power-on reset places ic in standby mode (non-alarm state) ? electrostatic discharge (esd) and lat ch up protection circuitry on all pins ? chip complexity: 2000 fets, 12 npns, 16 resistors, and 10 capacitors ? supports nfpa 72, ansi s3.41, and iso 8201 audible emergency evacuation signals ? ideal for battery-powered applications ? pb-free packaging designated by suffix codes ed and eg ordering information device temp. range case no. package mc145012p -55 to +125c 648-08 16 lead plastic dip mc145012ed 16 pdip (pb-free) mc145012dw 751g-04 16 lead soicw mcz145012eg/r2 16 soicw (pb-free) mc145012 photoelectric smoke detector ic with i/o and temporal pattern horn driver p suffix ed suffix (pb-free) plastic dip case 648-08 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 c1 c2 detect strobe vdd ired i/o brass test low-supply trip vss r1 osc led feedback silver dw suffix eg suffix (pb-free) soic package case 751g-04 figure 1. pin connections
sensors 2 freescale semiconductor mc145012 figure 2. block diagram temporal pattern horn modulator and driver + - + - detect osc r1 test strobe low-supply trip 3 12 13 16 4 15 2 1 c1 c2 osc amp comp comp alarm logic v dd - 5 v ref timing logic v dd - 3.5 v ref zero gain low supply smoke gate on/off gate on/off 8 9 10 6 11 7 pin 5 = v dd pin 14 = v ss led ired feedback silver brass i/o
sensors freescale semiconductor 3 mc145012 table 1. maximum ratings all voltages are with respect to ground unless otherwise noted. exceeding these ratings may cause a malfunction or permanent d amage to the device. (voltages referenced to v ss ) rating symbol value unit dc supply voltage v dd - 0.5 to +12 v dc input voltage c1, c2, detect osc, low-supply trip i/o feedback test v in - 0.25 to v dd +0.25 - 0.25 to v dd +0.25 - 0.25 to v dd +10 - 15 to +25 - 1.0 to v dd +0.25 v dc input current, per pin i in 10 ma dc output current, per pin i out 25 ma dc supply current, v dd and v ss pins i dd +25 / - 150 ma power dissipation in still air 5 seconds continuous p d 1200 (1) 350 (2) mw storage temperature t stg - 55 to +125 c lead temperature, 1 mm from case for 10 seconds t l 260 c peak package reflow temperature during reflow (3) , (4) t pprt note 4 c note: 1. derating: -12 mw/ c from 25 to 60 c 2. d erating: -3.5 mw/c from 25 to 60 c. this device contains protecti on circuitry to guard against damage due to high stat ic voltages or electric fields. however, prec autions must be taken to avoid applications of any vo ltage higher than maximum rated voltages to this high-impedance circuit. for proper ope ration, v in and v out should be constrained to the range v ss (v in or v out ) v dd except for the i/o, which can exceed v dd , and the test input, which can go below v ss . unused inputs must always be tied to an appropriate logic voltage level (e.g., either v ss or v dd ). unused outputs and/or an unused i/o must be left open. 3. pin soldering temperature limit is for 10 seconds maximum duration. not designed fo r immersion soldering. exceeding these lim its may cause malfunction or permanent damage to the device. 4. freescale?s package reflow c apability meets pb-free requirements for jedec standerd j-std-020c. for peak package reflow temperature and moisture sensitivity levels (msl), > go to www.freescale.com > search by part number [e.g. remove prefixes/suffixes and enter the core id to view all orderable parts. (ie. mc33xxxd enter 3 3xxx)] > locate your part number and in the details column, select ?view? > select ?environmental and compliance information?
sensors 4 freescale semiconductor mc145012 table 2. electrical characteristics (voltages referenced to v ss , t a = - 10 to 60 c unless otherwise indicated). characteristic symbol test condition v dd v min max unit power supply voltage range v dd ?6.0 12v supply threshold voltage, low-supply alarm v th low-supply trip: v in = v dd /3 ? 6.5 7.8 v average operating supply current (per package) (does not include current through d3-ir emitter) i dd standby configured per figure 8 12.0 ? 8.0 a peak supply current (per package) (does not include ired current into base of q1) i dd during strobe on, ired off configured per figure 8 12.0 ? 2.0 ma during strobe on, ired on configured per figure 8 12.0 ? 3.0 low-level input voltage i/o feedback test v il 9.0 9.0 9.0 ? ? ? 1.5 2.7 7.0 v high-level input voltage i/o feedback test v ih 9.0 9.0 9.0 3.2 6.3 8.5 ? ? ? v input current osc, detect low-supply trip feedback i in v in = v ss or v dd v in = v ss or v dd v in = v ss or v dd 12.0 12.0 12.0 ? ? ? 100 100 100 na low-level input current test i il v in = v ss 12.0 - 100 - 1.0 a pull-down current test i/o i ih v in = v dd no local smoke, v in = v dd no local smoke, v in = 17 v 9.0 9.0 12.0 0.5 25 ? 10 100 140 a low-level output voltage led silver, brass v ol i out = 10 ma i out = 16 ma 6.5 6.5 ? ? 0.6 1.0 v high-level output voltage silver, brass v oh i out = - 16 ma 6.5 5.5 ? v output voltage strobe (for line regulation, see pin descriptions) ired v out inactive, i out =1 a active, i out = 100 a to 500 a (load regulation) ? 9.0 v dd - 0.1 v dd - 4.40 ? v dd - 5.30 v inactive, i out = 1 a active, i out = 6 ma (load regulation) ? 9.0 ? 2.25 (5) 0.1 3.75 (5) high-level output current i/o i oh local smoke, v out = 4.5 v 6.5 -4.0 ? ma local smoke, v out =v ss (short circuit current) 12.0 ? -16 off-state output leakage current led i oz v out =v ss or v dd 12.0 ? 1.0 a common mode c1, c2, detect voltage range v ic local smoke, push-button test, or chamber sensitivity test ?v dd - 4.0 v dd - 2.0 v smoke comparator internal reference voltage v ref local smoke, push-button test, or chamber sensitivity test ?v dd - 3.08 v dd - 3.92 v notes 5. t a = 25 c only.
sensors freescale semiconductor 5 mc145012 table 3. ac electrical characteristics (reference timing diagram figure 6 and figure 7 ) (t a = 25 c, v dd = 9.0 v, component values from figure 8 : r1 = 100.0 k ? , c3 = 1500.0 pf, r2 = 7.5 m ? ). no. parameter symbol test condition clocks min (6) typ (7) max (6) unit 1 oscillator period 1/f osc free-running sawtooth measured at pin 12 1.0 7.0 7.9 8.6 ms 2 led pulse period t led no local smoke, and no remote smoke 4096 28.8 32.4 35.2 s 3 remote smoke, but no local smoke ? extinguished 4 local smoke 64 0.45 ? ? 5 push-button test 64 0.45 ? ? 6 led pulse width and strobe pulse width t w(led) , t w(stb) 1.0 7.0 ? 8.6 ms 7 ired pulse period t ired smoke test 1024 7.2 8.1 8.8 s 8 ired pulse period t ired chamber sensitivity test, without local smoke 4096 28.8 32.4 35.2 s 9 push-button test 128 0.9 1.0 1.1 10 ired pulse width t w(ired) t f * 94 ? 116 s 11 ired rise time t r ? ? ? 30 12 ired fall time t f ? ? ? 200 s 13 silver and brass temporal modulation pulse width t on 64 0.45 0.5 0.55 s 14 t off 0.45 0.5 0.55 15 t offd 192 1.35 1.52 1.65 16 silver and brass chirp pulse period t ch low supply or degraded chamber sensitivity 4096 28.8 32.4 35.2 s 17 silver and brass chirp pulse width t wch 1 7.0 7.9 8.6 ms 18 rising edge on i/o to smoke alarm response time t rr remote smoke, no local smoke ? ? 2.0 (8) ? s 19 strobe out pulse period t stb smoke test 1024 7.2 8.1 8.8 s 20 chamber sensitivity test, without local smoke 4096 28.8 32.4 35.2 21 low supply test, without local smoke 4096 28.8 32.4 35.2 22 push-button test ? ? 1.0 ? notes 6. oscillator period t (= t r + t f ) is determined by the external components r1, r2, and c3 where t r = (0.6931) r 2 c 3 and t f = (0.6931) r 1 * c 3 . the other timing characteristics are some multiple of the osci llator timing as shown in the table. the timing shown should ac commodate the nfpa 72, ansi s3.41, and iso 8201 audible emergency evacuation signals. 7. typicals are not guaranteed. 8. time is typical - depends on what point in cycle signal is applied.
sensors 6 freescale semiconductor mc145012 figure 3. ac characteristics versus supply figure 4. ac characteristics versus temperature figure 5. rc component variation over temperature pulse width of ired period or pulse width of other parameters ac parameter (normalized to 9.0 v value) vdd, power supply voltage (v) 1.02 0.98 0.96 1.00 1.04 6.0 7.0 8.0 9.0 10.0 11.0 12.0 t a = 25 c note: includes external component variations. see figure 5 . pulse width of ired period or pulse width of other parameters ac parameter (normalized to 25c value) t a , ambient temperature ( c) - 10 0 10 20 30 40 50 60 1.02 1.01 0.99 0.98 1.00 v dd = 9.0 v note: thes e components were used to generate figure 4 . 7.5 m ? carbon composition 100 k ? metal film 1500 pf dipped mica component value (normalized to 25c value) t a , ambient temperature ( c) - 10 0 10 20 30 40 50 60 1.03 1.02 1.01 1.00 0.99 0.98
sensors freescale semiconductor 7 mc145012 figure 6. typical standby timing low supply test (internal) photo sample (internal) chamber test (internal) 8 osc (pin 12) 1 led (pin 11) silver, brass (internal) enable 2 16 power-on reset no low supply chirps ired (pin 6) strobe (pin 4) 7 7 19 20 6 17 21 notes: numbers refer to the ac electrical charac teristics table. illustration is not to scale. chamber sensitivity ok indicate low supply chirps indicate degraded chamber sensitivity 16 21
sensors 8 freescale semiconductor mc145012 figure 7. typical local smoke timing 6 low supply test (internal ) ired (pin 6) chamber test (internal) strobe (pin 4) 7 i/o (pin 7) silver, brass (not performed) (not performed) 12 11 10 ired 10% 90% 18 9 22 led (pin 11) 6 5 3 (no pulses) (as input) (as output) (as output) enable (internal) 18 13 14 15 no smoke pushbutton test local smoke (remote smoke = don't care) remote smoke (no local smoke) 4 notes: numbers refer to the ac electrical characteristics table. illustration is not to scale. no smoke
sensors freescale semiconductor 9 mc145012 figure 8. typical battery-powered application table 4. pin description pin no. pin name description 1 c1 a capacitor connected to this pin as shown in figure 8 determines the gain of the on-c hip photo amplifier during push- button test and chamber sensitivity test (high gain). the capac itor value is chosen such that the alarm is tripped from background reflections in the chamber during push-button test. a v 1 + (c1/10) where c1 is in pf. caution: the va lue of the closed-loop gain should not exceed 10,000. 2 c2 a capacitor connected to this pin as shown in figure 8 determines the gain of the on-chip photo amplifier except during push-button or chamber sensitivity tests. a v 1 + (c2/10) where c2 is in pf. this gain increases a bout 10% during the ired pulse, after two consecutive local smoke detections. resistor r14 must be installed in series with c2. r14 [1/(12 c2 )] - 680 where r14 is in ohms and c2 is in farads. 3 detect this input to the high-gain pulse ampl ifier is tied to the cathode of an exte rnal photodiode. the photodiode should have low capacitance and low dark leakage current. the diode must be shunted by a load resistor and is operated at zero bias. the detect input must be ac/dc decoupled from all other signals, v dd , and v ss . lead length and/or foil traces to this pin must be minimized, also. see figure 9 . d2 ir detector 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 test low-supply trip vss r1 osc led feedback silver vdd ired i/o brass strobe detect c1 c2 horn x1 to other mc145012(s), escape light(s), auxiliary alarm(s), remote alarm(s), and/or auto-dialer ir current r13 (10) 4.7 to 22 q1 2.2 m r5 (9) d4 visible led r7 47 k r6 100 k sw1 + + mc145012 reverse polarity protection circuit pushbutton test r2 7.5 m 0.01 f c6 (9) c3 1500 pf r1 100 k r3 470 r4 (9) 100 k 9 v b1 d1 1 to 22 f c4 (12) c1 0.047 f c2 (10) 4700 pf r14 560 ? r11 250 k r8 8.2 k r9 (11) 5 k r10 4.7 k d3 ir emitter r12 1 k c5 100 f 9. values for r4, r5, and c6 may differ depending on type of piezoelectric horn used. 10.c2 and r13 are used for coarse sensitiv ity adjustment. typical values are shown. 11.r9 is for fine sensitivity adjustment (opt ional). if fixed resistors are used, r8 = 12 k, r10 is 5.6 k to 10 k, and r9 is el iminated. when r9 is used, noise pickup is increased due to antenna effects. shielding may be required. 12.c4 should be 22 f if b1 is a carbon battery. c4 could be reduced to 1 f when an alkaline battery is used.
sensors 10 freescale semiconductor mc145012 4 strobe this output provides a strobed, regulated voltage referenced to v dd . the temperature coeffici ent of this voltage is 0.2%/ c maximum from - 10 to 60 c. the supply-voltage coeffici ent (line regulation) is 0.2%/v maximum from 6.0 v to 12 v. strobe is tied to external resistor string r8, r9, and r10. 5 vdd this pin is connected to the positive supply potential and may range from + 6.0 v to + 12 v with respect to v ss caution: in battery-powered applications, reverse-pola rity protection must be provided externally. 6 ired this output provides pulsed base current for external npn tran sistor q1 used as the infrared emitter driver. q1 must have 100. at 10 ma, the temperature coefficien t of the output voltage is typically + 0.5%/ c from - 10 to 60 c. the supply-voltage coefficien t (line regulation) is 0.2%/v maximum from 6.0 v to 12 v. the ired pulse width (active-high) is determined by external components r1 and c3. with a 100 k ? /1500 pf combination, the nominal width is 105 s. to minimize noise impact, ired is not active when the vi sible led and horn outputs are acti ve. ired is active near the end of strobe pulses for smoke tests, cham ber sensitivity test, and push-button test. 7 i/o this pin can be used to connect up to 40 units together in a wired-or configuration for common signaling. v ss is used as the return. an on-chip current sink minimizes noise pick up during non-smoke conditions and eliminates the need for an external pull-down resistor to complete the wired-or. re mote units at lower supply voltages do not draw excessive current from a sending unit at a higher supply voltage. i/o can also be used to activate escape lights, auxil iary alarms, remote alarms, and/or auto-dialers. as an input, this pin feeds a positive-edge-triggered flip-flo p whose output is sampled nominally every 1 second during standby (using the recommended component values). a local-sm oke condition or the push-button-test mode forces this current-limited output to source current. all input signals are ignored when i/o is sourcing current. i/o is disabled by the on-chip power-on reset to eliminate nuisance signaling during battery changes or system power-up. if unused, i/o must be left unconnected. 8 brass this half of the push-pull driver output is connected to the metal support electrode of a pi ezoelectric audio transducer and to the horn-starting resistor. a continuous modulated tone from the transducer is a sm oke alarm indicating either local or remote smoke. a short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitivity. 9 silver this half of the push-pull driver output is connected to the metal support electrode of a pi ezoelectric audio transducer and to the horn-starting resistor. a continuous modulated tone from the transducer is a sm oke alarm indicating either local or remote smoke. a short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitivity. 10 feedback this input is connected to both the feedback electrode of a se lf-resonating piezoelectric transducer and the horn-starting resistor and capacitor through current-limiting resi stor r4. if unused, this pin must be tied to v ss or v dd . 11 led this active-low open-drain output directly drives an external visible led at the pulse rates indicated below. the pulse width is equal to the osc period. the load for the low-supply test is applied by this output. this low-supply test is non-coincident with the smoke tests, chamber sensitivity test, push-bu tton test, or any alarm signals. the led also provides a visual indication of the detector status as follow s, assuming the component values shown in figure 8 : standby (includes low-supply and c hamber sensitivity tests) ? puls es every 32.4 seconds (typical) standby (includes low-supply and c hamber sensitivity tests) ? puls es every 32.4 seconds (typical) local smoke ? pulses ever y 0.51 seconds (typical) remote smoke ? no pulses push-button test ? pulses every 0.51 seconds (typical) 12 osc this pin is used in conjunction with external resistor r2 (7.5 m ? ) to v dd and external capacitor c3 (1500 pf) to v dd to form an oscillator with a nomi nal period of 7.9 ms (typical). 13 r1 this pin is used in conjunction with resistor r1 (100 k ? ) to pin 12 and c3 (1500 pf, see pin 12 description) to determine the ired pulse width. with this rc comb ination, the nominal pulse width is 105 s. 14 vss this pin is the negative supply potential and the return for the i/o pin. pin 14 is usually tied to ground. 15 low- supply trip this pin is connected to an external voltage which determi nes the low-supply alarm thre shold. the trip voltage is obtained through a resistor divider connected between the v dd and led pins. the low-supply alarm threshold voltage (in volts) (5r7/r6) + 5 where r6 and r7 are in the same units. 16 test this input has an on-chip pu ll-down device and is used to manually invoke a test mode. the push-button test mode is initiated by a high level at pin 16 (usually depression of a s.p.s.t. normally-open push- button switch to v dd ). after one oscillator cycle, ired pulses approx imately every 1.0 second, regardless of the presence of smoke. additionally, the amplifier gain is increased by automatic selection of c1. therefore, the background reflections in the smoke chamber may be interpreted as smoke, generat ing a simulated-smoke condition. after the second ired pulse, a successful test activates the horn-driver and i/o circuits. the active i/o allows remote signaling for system testing. when the push-button test switch is released, the test input returns to v ss due to the on-chip pull-down device. after one oscillator cycle, the amplifier gain returns to norm al, thereby removing the simulat ed-smoke condition. after two additional ired pulses, less than three seconds, the ic exits the alarm mode and returns to standby timing. table 4. pin description (continued) pin no. pin name description
sensors freescale semiconductor 11 mc145012 calibration to facilitate checking the se nsitivity and calibrating smoke detectors, the mc145012 can be placed in a calibration mode. in this mode, certain device pins are controlled/ reconfigured as shown in ta b l e 5 . to place the part in the calibration mode, pin 16 (test) must be pulled below the v ss pin with 100 a continuously drawn out of the pin for at least one cycle on the osc pin. to exit this mode, the test pin is floated for at least one osc cycle. in the calibration mode, the ired pulse rate is increased to one for every osc cycle. also, strobe is always active low. figure 9. recommended pcb layout table 5. configuration of pins in the calibration mode description pin comment i/o 7 disabled as an output. forcing this pin high places the photo amp output on pin 1 or 2, as determined by low- supply trip. the amp's output appears as pulses and is referenced to v dd etc. low-supply trip 15 if the i/o pin is high, pin 15 controls which gain capacitor is used. low: normal gain, amp output on pin 1. h igh: supervisory gain, amp output on pin 2. feedback 10 driving this input high enables hysteresis (10% gain increase) in the photo amp; pin 15 must be low. osc 12 driving this input high brings the internal clock high. driving the input low brings the internal clock low. if desired, the rc network for the oscillator may be left intact; this allows the oscillator to run similar to the normal mode of operation. silver 9 this pin becomes the smoke com parator output. when the osc pin is togg ling, positive pulses indicate that smoke has been detected. a static low level indicates no smoke. brass 8 this pin becomes the smoke integrator output. that is, 2 consecutive smoke detec tions are required for ?on? (static high level) and 2 consecutive no-det ections for ?off? (static low level). notes: illustration is bottom view of layout using a dip. top view for soic layout is mirror image. optional potentiometer r9 is not included. drawing is not to scale. leads on d2, r11, r8, and r10 and their associated traces must be kept as short as possible. this practice minimizes noise pick up. pin 3 must be decoupled from all other traces. do not run any additional traces in this region pin 8 pin 16 pin 9 pin 1 r8 r11 d2 c2 r14 c1 r10 0 mounted in chamber
sensors freescale semiconductor 12 mc145012 package dimensions notes: 1. 2. 3. 4. 5. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. dimension l to center of leads when formed parallel. dimension b does not include mold flash. rounded corners optional. -a- b f c s h g d 16 pl j l m seating plane 18 9 16 k -t- m a m 0.25 (0.010) t dim min max min max millimeters inches a 0.740 0.770 18.80 19.55 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.040 0.70 1.02 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.110 0.130 2.80 3.30 l 0.295 0.305 7.50 7.74 m 010010 s 0.020 0.040 0.51 1.01 style 1: pin 1. cathode 2. cathode 3. cathode 4. cathode 5. cathode 6. cathode 7. cathode 8. cathode 9. anode 10. anode 11. anode 12. anode 13. anode 14. anode 15. anode 16. anode style 2: pin 1. common drain 2. common drain 3. common drain 4. common drain 5. common drain 6. common drain 7. common drain 8. common drain 9. gate 10. source 11. gate 12. source 13. gate 14. source 15. gate 16. source case 648-08 issue r 16-lead plastic dip notes: 1. 2. 3. 4. 5. 6. dimensions are in millimeters. dimensioning and tolerancing per asme y14.5m, 1994. datums a and b to be determined at the plane where the bottom of the leads exit the plastic body. this dimension does not include mold flash, protrusion or gate burrs. mold flash, protrustion or gate burrs shall not exceed 0.15mm per side. this dimension is determined at the plane where the bottom of the leads exit the plastic body. this dimension does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 0.25mm per side. this dimension is determined at the plane where the bottom of the leads exit the plastic body. this dimension does not include dambar protrusion. allowable dambar protrusion shall not cause the lead width to exceed 0.62mm. seating plane 0.49 16x b m 0.25 a t 0.35 2.65 2.35 0.25 0.10 6 t 16x 0.1 t 1.27 14x 89 1 16 8x 10.55 10.05 m 0.25 b 4 10.45 10.15 a 7.6 7.4 b pin 1 index pin's number 5 a a 0.75 x45 ? 0.25 7? 1.0 0.4 0? 0.32 0.23 section a-a case 751g-04 issue d 16-lead soic
sensors freescale semiconductor 13 mc145012 revision history revision date description of changes 9.0 11/2006 ? implemented revision history page ? updated to the current freescale format and style ? removed peak package reflow temperature duri ng reflow (solder reflow) parameter from maximum ratings on page 3 . added note with instructions from www.freescale.com .
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